Intel (technical journal)
note: The linked documents can not be downloaded from the public version of this site.
| Intel Technical Journal |
||||
| title | order # | date | on-line? (FILE or HTTP) |
|
| MMX technology architecture overview | ??? | Q3/97 | ||
| MMX microarchitecture of Pentium with MMX technology and Pentium II processors | ??? | Q3/97 | ||
| implementation of a high quality Dolby digital decoder using MMX technology | ??? | Q3/97 | ||
| redundancy and high-volume manufacturing methods | ??? | Q4/97 | ||
| redundancy yield model for SRAMs | ??? | Q4/97 | ||
| overview of the Intel TFLOPS | ??? | Q1/98 | ||
| performance of the Intel TFLOPS | ??? | Q1/98 | ||
| achieving large scale parallelism through OS resource mgmt. on the Intel TFLOPS | ??? | Q1/98 | ||
| scalable platform services on the Intel TFLOPS | ??? | Q1/98 | ||
| Illinois-Intel multithreading library: multithreading support for IA-based MP systems | ??? | Q1/98 | ||
| overview of advanced failure analysis techniques for P5 and P6 processors | ??? | Q2/98 | ||
| proving the IEEE correctness of iterative FP SQRT, DIV, and REM algorithms | ??? | Q2/98 | ||
| Intel's 0.25 micron, 2.0 volts logic process technology | ??? | Q3/98 | ||
| The quality and reliability of Intel's quarter micron process | ??? | Q3/98 | ||
| MOS scaling: transistor challenges for the 21st century | ??? | Q3/98 | ||
| EUV lithography -- The successor to optical lithography? | ??? | Q3/98 | ||
| 21st century semiconductor manufacturing capabilities | ??? | Q4/98 | ||
| The evolution of Intel's Copy EXACTLY! technology transfer method | ??? | Q4/98 | ||
| manufacturing operations system design and analysis | ??? | Q4/98 | ||
| planning for the 300mm transition | ??? | Q4/98 | ||
| improving throughput accross the factory life-cycle | ??? | Q4/98 | ||
| line defect control to maximize yields | ??? | Q4/98 | ||
| enabling integrated solutions for gigahertz designs | ??? | Q1/99 | ||
| circuit design environment and layout planning | ??? | Q1/99 | ||
| challenges of CAD development for datapath design | ??? | Q1/99 | ||
| CAD design flows development in a cross-platform computing environment | ??? | Q1/99 | ||
| formally verifying IEEE compliance of floating-point hardware | ??? | Q1/99 | ||
| defect based test: a key enabler for successful migration to structural test | ??? | Q1/99 | ||
| The internet streaming SIMD extensions | ??? | Q2/99 | ||
| Pentium III processor implementation tradeoffs | ??? | Q2/99 | ||
| Pentium III processor serial number feature and applications | ??? | Q2/99 | ||
| architecture of a 3D software stack for peak Pentium III processor performance | ??? | Q2/99 | ||
| applications tuning for streaming SIMD extensions | ??? | Q2/99 | ||
| programming methods for the Pentium III processor's SSE using VTune | ??? | Q2/99 | ||
| assembly language programming tools for the IA-64 architecture | ??? | Q4/99 | ||
| an overview of the Intel IA-64 compiler | ??? | Q4/99 | ||
| IA-64 FP operations and the IEEE standard for binary FP arithmetic | ??? | Q4/99 | ||
| computation of transcendental functions on the IA-64 architecture | ??? | Q4/99 | ||
| SoftSDV: a presilicon software development environment for the IA-64 architecture | ??? | Q4/99 | ||
| porting OS kernels to the IA-64 architecture for presilicon validation purposes | ??? | Q4/99 | ||
| the evolution of microprocessor packaging | ??? | Q3/00 | ||
| flip-chip technology on organic pin grid array packages | ??? | Q3/00 | ||
| package-level interconnect design for optimum electrical performance | ??? | Q3/00 | ||
| thermal performance challenges from silicon to systems | ??? | Q3/00 | ||
| simultaneous chip-join and underfill assembly technology for flip-chip packaging | ??? | Q3/00 | ||
| a mechanism-based methodology for processor package reliability assessments | ??? | Q3/00 | ||
| thermal challenges during microprocessor testing | ??? | Q3/00 | ||
| recollections of early chip development at Intel | ??? | Q1/01 | ||
| the microarchitecture of the Pentium 4 processor | ??? | Q1/01 | ||
| validating the Pentium 4 processor | ??? | Q1/01 | ||
| managing the impact of increasing microprocessor power consumption | ??? | Q1/01 | ||
| interconnect and noise immunity design for the Pentium 4 processor | ??? | Q1/01 | ||
| efficient exploitation of parallelism on P3 and P4 processor-based systems | ??? | Q1/01 | ||
| a discussion of PC platform balance: the P4 processor-based platform solutions | ??? | Q1/01 | ||
| The evolving role of automation in microprocessor development and manufacturing | ??? | Q3/01 | ||
| The making of a compiler for the Intel Itanium processor | ??? | Q3/01 | ||
| volume 06 issue 01 (all of the following articles) | ??? | Q1/02 | ||
| hyper-threading technology architecture and microarchitecture | ??? | Q1/02 | ||
| pre-silicon validation of hyper-threading technology | ??? | Q1/02 | ||
| speculative precomputation: exploring the use of multithreading for latency | ??? | Q1/02 | ||
| Intel OpenMP C++/Fortran compiler for hyper-threading technology: implementation... | ??? | Q1/02 | ||
| media applications on hyper-threading technology | ??? | Q1/02 | ||
| hyper-threading technology: impact on compute-intensive workloads | ??? | Q1/02 | ||
| volume 06 issue 02 (all of the following articles) | ??? | Q2/02 | ||
| 130nm logic technology featuring 60nm transistors, low-k dielectrics, and Cu ... | ??? | Q2/02 | ||
| process development and manufacturing of ... processors on 300mm wafers | ??? | Q2/02 | ||
| ETOX flash memory technology: scaling and integration challenges | ??? | Q2/02 | ||
| integration of mixed-signal elements into a high-performance digital CMOS process | ??? | Q2/02 | ||
| transistor elements for 30nm physical gate lengths and beyond | ??? | Q2/02 | ||
| the Intel lithography roadmap | ??? | Q2/02 | ||
| emerging directions for packaging technologies | ??? | Q2/02 | ||
| volume 07 issue 02 (all of the following articles) | ??? | Q2/03 | ||
| mobile PC platforms enabled with Intel Centrino mobile technology | ??? | Q2/03 | ||
| innovation brings low power int. graphics to the Intel Centrino mobile technology platform | ??? | Q2/03 | ||
| the Intel Pentium M processor: microarchitecture and performance | ??? | Q2/03 | ||
| system-level validation of the Intel Pentium M processor | ??? | Q2/03 | ||
| Intel Pentium M processor power estimation, budgeting, optimization, and validation | ??? | Q2/03 | ||
| antenna selection in multicarrier communication systems | ??? | Q2/03 | ||
| volume 08 issue 01 (all of the following articles) | ??? | Q1/04 | ||
| the microarchitecture of the Intel Pentium 4 processor on 90 nm technology | ??? | Q1/04 | ||
| support for the Intel Pentium 4 processor with HT technology in Intel 8.0 compilers | ??? | Q1/04 | ||
| perf. analysis and validation of the Intel Pentium 4 processor on 90 nm technology | ??? | Q1/04 | ||
| LVS technology for the Intel Pentium 4 processor on 90 nm technology | ??? | Q1/04 | ||
| library architecture challenges for cell-based design | ??? | Q1/04 | ||
| full hold-scan systems in microprocessors: cost/benefit analysis | ??? | Q1/04 | ||
| volume 09 issue 01 (all of the following articles) | ??? | Q1/05 | ||
| second-generation Intel Centrino mobile technology | ??? | Q1/05 | ||
| Intel 915GMS chipset: in mobile platforms, smaller is better | ??? | Q1/05 | ||
| the emergence of PCI Express in the next generation of mobile platforms | ??? | Q1/05 | ||
| high-performance graphics and TV output comes to the... | ??? | Q1/05 | ||
| low-power audio and storage I/O technologies for the... | ??? | Q1/05 | ||
| performance and power consumption for mobile platform components under... | ??? | Q1/05 | ||
| interface material selection and a thermal management technique in... | ??? | Q1/05 | ||
| next-generation PC platform built on... | ??? | Q1/05 | ||
| volume 09 issue 04 (all of the following articles) | ??? | Q4/05 | ||
| advanced package technologies for high-performance systems | ??? | Q4/05 | ||
| power delivery for high-performance microprocessors | ??? | Q4/05 | ||
| nano and micro technology-based next-generation package-level cooling solutions | ??? | Q4/05 | ||
| finding solutions to the challenges in packet interconnect reliability | ??? | Q4/05 | ||
| materials technologies for thermomechanical management of organic packages | ??? | Q4/05 | ||
| Pentium 4 processor high-volume LGA technology: challenges and future trends | ??? | Q4/05 | ||
| advanced fault isolation and failure analysis techniques for future package technologies | ??? | Q4/05 | ||
| future package technologies for wireless communication systems | ??? | Q4/05 | ||
| volume 10 issue 02 (all of the following articles) | ??? | Q2/06 | ||
| introduction to Intel Core Duo processor architecture | ??? | Q2/06 | ||
| CMP implementation in systems based on the Intel Core Duo processor | ??? | Q2/06 | ||
| power and thermal management in the Intel Core Duo processor | ??? | Q2/06 | ||
| system memory power and thermal management in platforms built on... | ??? | Q2/06 | ||
| Intel 945GMS Express chipset for small form factor platform based on... | ??? | Q2/06 | ||
| WLAN system, HW, and RFIC architecture for the Intel PRO/wireless 3945ABG... | ??? | Q2/06 | ||
| MIMO architecture for wireless communication | ??? | Q2/06 | ||
| volume 10 issue 03 (all of the following articles) | ??? | Q3/06 | ||
| Intel VT: hardware support for efficient processor virtualization | ??? | Q3/06 | ||
| Intel VT for directed I/O | ??? | Q3/06 | ||
| extending Xen with Intel VT | ??? | Q3/06 | ||
| new client virtualization usage models using Intel VT | ??? | Q3/06 | ||
| Intel VT in embedded and communications infrastructure applications | ??? | Q3/06 | ||
| virtualization in the enterprise | ??? | Q3/06 | ||
| redefining server performance characterization for virtualization benchmarking | ??? | Q3/06 | ||
| machine learning for adaptive power management | ??? | Q4/06 | ||
| IEEE 754R decimal floating-point arithmetic | ??? | Q1/07 | ||
| volume 11 issue 03 (all of the following articles) | ??? | Q3/07 | ||
| integration challenges and tradeoffs for tera-scale architectures | ??? | Q3/07 | ||
| accelerator exoskeleton | ??? | Q3/07 | ||
| package technology to address the memory bandwidth challenge for tera-scale comp... | ??? | Q3/07 | ||
| run-time environment for tera-scale platforms | ??? | Q3/07 | ||
| architectural support for fine-grained parallelism on multi-core architectures | ??? | Q3/07 | ||
|
datacenter-on-chip architectures: tera-scale opportunities and challenges in Intel's manufacturing environment |
??? | Q3/07 | ||
| media mining -- emerging tera-scale computing applications | ??? | Q3/07 | ||
| high-performance physical simulations on next-generation architecture with many cores | ??? | Q3/07 | ||
| volume 11 issue 04 (all of the following articles) | ??? | Q4/07 | ||
| inside the Intel 10.1 compilers: new threadizer and new vectorizer for Core 2 | ??? | Q4/07 | ||
| parallelization made easier with Intel performance-tuning utility | ??? | Q4/07 | ||
| parallel software development with Intel threading analysis tools | ??? | Q4/07 | ||
| Intel performance libraries: multi-core-ready software for numeric-intensive computation | ??? | Q4/07 | ||
| the foundation for scalable multi-core softare in Intel threading building blocks | ??? | Q4/07 | ||
| methodology, tools, and techniques to parallelize large-scale applications: a case study | ??? | Q4/07 | ||
| future-proof data parallel algorithms and software on Intel multi-core architecture | ??? | Q4/07 | ||
| accelerating video feature extractions in CBVIR on multi-core systems | ??? | Q4/07 | ||
| process scheduling challenges in the era of multi-core processors | ??? | Q4/07 | ||
| volume 12 issue 01 (all of the following articles) | ??? | Q1/08 | ||
| material technology for environmentally green micro-electronic packaging | ??? | Q1/08 | ||
| dynamic data center power measurement: trends, issues, and solutions | ??? | Q1/08 | ||
| evaluation process for semiconductor fabrication materials that are better for the env... | ??? | Q1/08 | ||
