Intel (packaging technology)
note: The linked documents can not be downloaded from the public version of this site.
| Intel Packaging Technology |
||||
| title | order # | date | on-line? (FILE or HTTP) |
|
| packaging (part 1/17: chapter 1, introduction) | ??? | 1999 | ||
| packaging (part 2/17: chapter 2, package/module/pc card outlines and dimensions) | ??? | 1999 | ||
| packaging (part 3/17: chapter 3, alumina and leaded molded technology) | ??? | 2000 | ||
| packaging (part 4/17: chapter 4, performance characteristics of IC packages) | ??? | 2000 | ||
| packaging (part 5/17: chapter 5, physical constants of IC package materials) | ??? | 2000 | ||
| packaging (part 6/17: chapter 6, ESD/EOS) | ??? | 2000 | ||
| packaging (part 7/17: chapter 7, leaded surface mount technology (SMT)) | ??? | 2000 | ||
| packaging (part 8/17: chapter 8, moisture sensitivity/desiccant packaging/handling) | ??? | 2000 | ||
| packaging (part 9/17: chapter 9, board solder reflow process recommendations) | ??? | 2007 | ||
| packaging (part 10/17: chapter 10, shipping and transport media) | ??? | 2004 | ||
| packaging (part 11/17: chapter 11, international packaging specifications) | ??? | 2000 | ||
| packaging (part 12/17: chapter 12, tape carrier package) | ??? | 2000 | ||
| packaging (part 13/17: chapter 13, pinned packaging) | ??? | 2000 | ||
| packaging (part 14/17: chapter 14, ball grid array (BGA) packaging) | ??? | 2000 | ||
| packaging (part 15/17: chapter 15, chip scale package (CSP)) | ??? | 2000 | ||
| packaging (part 16/17: chapter 16, cartridge packaging) | ??? | 2000 | ||
| packaging (part 17/17: glossary) | ??? | 1999 | ||
|
knowledge based reliability evaluation of new package technologies utilizing use conditions |
245162-001 | 03/99 | ||
| material content of IC packaging | ??? | 10/04 | ||
| material content of IC packaging: BGA | ??? | 05/06 | ||
| material content of IC packaging: PBGA | ??? | 05/06 | ||
| material content of IC packaging: FCBGA1 | ??? | 05/06 | ||
| material content of IC packaging: LCC | ??? | 10/04 | ||
| material content of IC packaging: PGA | ??? | 05/06 | ||
| material content of IC packaging: QFP | ??? | 12/05 | ||
| material content of IC packaging: SOP | ??? | 05/06 | ||
| material content of IC packaging: other | ??? | 05/06 | ||
| material content of IC packaging: boxed | ??? | 09/06 | ||
